Description

Koch Chemie Micro Cut Pad

Micro Cut Pad High-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability.

The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier.

The colourful non-woven material, suitable for polishing, ensures process safety.

Size: Ø 

45-150 x 23 mm 

Compression hardness: 10

Abrasiveness: 5

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