Koch Chemie Dual-Action Polishing and Sealant Application Pad

Description

The Koch Chemie Polishing & Sealing Pad is made from extra fine sponge designed to economically and evenly apply sealing products such as Koch Chemie 1K Nano. The short height of 23mm creates low torsion forces whilst providing a high level of stability and excellent handling. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.

• Compression hardness: 4.
• Abrasiveness: 2.

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